Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group
  • Journal of Lightwave Technology
  • Vol. 36,
  • Issue 16,
  • pp. 3528-3533
  • (2018)

Aerosol-Jet Printed Interconnects for 2.5 D Electronic and Photonic Integration

Not Accessible

Your library or personal account may give you access

Abstract

We demonstrate a flexible face-up 2.5 D packaging technique for a hybrid electro-photonic integration. The process is based on an aerosol-jet technology to print the high-speed electrical interconnects between electronic and photonic chips as a potential alternative for the traditional bonding wires. The technology is realized by creating a transparent mechanical polymer support to bridge the gap between the photonic and electronic chips and subsequently printing the electrical interconnects on top. First, the daisy-chain test chips were used to prove the functionality of the technology by printing the electrical interconnects between the test chips. Then, a standard 85 ° C/85 RH test was performed to investigate the reliability of the printed interconnects and no failure or degradation was observed over 700 h. Afterwards, the technology was successfully applied on functional chips. An optical transmitter based on vertical cavity surface emitting lasers (VCSELs) was demonstrated at 50 Gb/s by printing 200-μm-long high-speed silver interconnects between a 4-channel SiGe BiCMOS driver and four VCSELs. In addition, the technology showed the potential to interconnect silicon photonics chips. An assembly of an electro-absorption modulator (EAM) and a CMOS driver was successfully demonstrated. Clear open eye diagrams were obtained at 40, 50, and 56 Gb/s for the EAM-driver assembly even after 2 km of a standard single-mode fiber.

© 2018 IEEE

PDF Article
More Like This
3D printed multimode-splitters for photonic interconnects

Johnny Moughames, Xavier Porte, Laurent Larger, Maxime Jacquot, Muamer Kadic, and Daniel Brunner
Opt. Mater. Express 10(11) 2952-2961 (2020)

Silicon electronic–photonic integrated 25  Gb/s ring modulator transmitter with a built-in temperature controller

Minkyu Kim, Min-Hyeong Kim, Youngkwan Jo, Hyun-Kyu Kim, Stefan Lischke, Christian Mai, Lars Zimmermann, and Woo-Young Choi
Photon. Res. 9(4) 507-513 (2021)

3-D integrated heterogeneous intra-chip free-space optical interconnect

Berkehan Ciftcioglu, Rebecca Berman, Shang Wang, Jianyun Hu, Ioannis Savidis, Manish Jain, Duncan Moore, Michael Huang, Eby G. Friedman, Gary Wicks, and Hui Wu
Opt. Express 20(4) 4331-4345 (2012)

Cited By

You do not have subscription access to this journal. Cited by links are available to subscribers only. You may subscribe either as an Optica member, or as an authorized user of your institution.

Contact your librarian or system administrator
or
Login to access Optica Member Subscription

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved