Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

Dual-Angle Imaging System (DAISy) for Determining the Thickness of a Dielectric Thin Film

Not Accessible

Your library or personal account may give you access

Abstract

A team of undergraduate engineers in Optics were tasked to build a Dual-Angle Imaging System (DAISy) to measure the physical thickness of a dielectric film on silicon. This paper details their working prototype design.

© 2019 The Author(s)

PDF Article
More Like This
SiO2 Film Thickness Determination on Silicon Using Dual-Angle Imaging

Jennifer D. T. Kruschwitz and Roy S. Berns
ThB.7 Optical Interference Coatings (OIC) 2016

Determination of The Optical Constants and Thickness of Thin Films by Measurement of Surface Plasmon Resonances

F. S. Zhang, H. A. Macleod, and M. R. Jacobson
WC20 Optical Interference Coatings (OIC) 1988

A Method for Determining Dielectric Losses of Thin Films

R. Lalezari, M. Kriewaldt, and D. Long
OThD7 Optical Interference Coatings (OIC) 1992

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved