Photonic Integrated Circuit based sensing modules with hybrid integration in the silicon nitride TriPleX™ platform

Arne Leinse; Douwe Geuzebroek

doi:10.1364/OFC.2019.Tu2D.4

Optical Fiber Communication Conference (OFC) 2019
OSA Technical Digest (Optica Publishing Group, 2019),
paper Tu2D.4
•https://doi.org/10.1364/OFC.2019.Tu2D.4

Photonic Integrated Circuit based sensing modules with hybrid integration in the silicon nitride TriPleX™ platform

Arne Leinse and Douwe Geuzebroek

Optical Fiber Communication Conference 2019

San Diego, California United States
3–7 March 2019
ISBN: 978-1-943580-53-8

From the session
Symposia: Photonics for IoT and Sensing: Manufacturing, Packaging and Application 1 (Tu2D)

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A. Leinse and D. Geuzebroek, "Photonic Integrated Circuit based sensing modules with hybrid integration in the silicon nitride TriPleX™ platform," in Optical Fiber Communication Conference (OFC) 2019, OSA Technical Digest (Optica Publishing Group, 2019), paper Tu2D.4.

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Abstract

Silicon-Nitride (Si₃N₄) based photonic integrated circuits (PICs) enable a good biophotonic sensing platform. The platforms allows integration of multiple sensor elements and operates over a broad wavelength range. The use of PIC technology allows it to be very sensitive as well as allow for wide dynamic ranges. Combined with (hybrid) integration of sources and detectors make the platform suitable both for high end desktop applications, as well as single use, disposable. The PIC platform and (hybrid) integration are described in this article and examples of biophotonic sensing are shown.

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