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Conferences > OFC > 2019 > M4D > M4D.5

Seamless Hybrid-integrated Interconnect NEtwork (SHINE)

Shaoliang Yu, Haijie Zuo, Xiaoxin Wang, Xiaochen Sun, Jifeng Liu, Juejun Hu, and Tian Gu

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Abstract

We describe an optical communication technology scalable across chip-, board-, and rack-interconnect levels for data centers. The approach claims high energy efficiency, large bandwidth density, and is compatible with standard area-bonding and pick-and-place chip assembly.

© 2019 The Author(s)

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