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Conferences > OFC > 2018 > Tu2A > Tu2A.1

Expanded-Beam Through-Substrate Coupling Interface for Alignment Tolerant Packaging of Silicon Photonics

N. Mangal, J. Missinne, G. Roelkens, J. Van Campenhout, G. Van Steenberge, and B. Snyder

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Abstract

We demonstrate an alignment tolerant through-substrate coupling interface by combining an optimized downward-directionality grating on a silicon photonic chip with a hybrid integrated polymer lens, generating a collimated beam at λ=1310nm for more than 600µm.

© 2018 The Author(s)

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