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Inter-die fabrication uniformity of silicon photonic fiber-to-waveguide edge couplers

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Abstract

Silicon-on-insulator fiber-to-waveguide inverse taper edge couplers of different tip widths of 120nm to 200nm are fabricated using a multi-project wafer service. The coupling efficiencies and the inter-die fabrication uniformity of the edge couplers are compared.

© 2018 The Author(s)

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