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U -Bend Silicon Waveguide Interconnect for 3 D Multilayer Photonics Integrated Circuit

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Abstract

Critical physical and geometrical parameters of the proposed U-bend silicon waveguide interconnect are ascertained for its application in multi-layered hybrid 3-dimensional Photonics Integrated circuits (3D-PICs). A possible fabrication methodology is also discussed.

© 2017 Optical Society of America

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