This work shows a procedure in which the surface Plasmon resonance phenomena based on attenuated total reflection method was used to determine the dielectric constant and an approximate thickness of two thin copper (Cu) films.

© 2018 The Author(s)

PDF Article


You do not have subscription access to this journal. Citation lists with outbound citation links are available to subscribers only. You may subscribe either as an OSA member, or as an authorized user of your institution.

Contact your librarian or system administrator
Login to access OSA Member Subscription