Abstract
The heterogeneous integration of AlGaAs-on-insulator has great potential for nonlinear optics. This talk will explore chip-scale bonding and transfer printing techniques for the development of integrated photonic chips for second- and third-order non-linear applications.
© 2019 The Author(s)
PDF ArticleMore Like This
B. Corbett, R. Loi, J. O’Callaghan, L. Liu, K. Thomas, A. Gocalinska, E. Pelucchi, A. J. Trindade, C. A. Bower, G. Roelkens, and B. Roycroft
M2D.1 Optical Fiber Communication Conference (OFC) 2019
Minhao Pu, Chanju Kim, Erik Stassen, Yi Zheng, Yong Liu, Elizaveta Semenova, and Kresten Yvind
T3D.2 Asia Communications and Photonics Conference (ACP) 2019
Christian Lafforgue, Samuel Serna, Sylvain Guerber, Hongtao Lin, Joan Manel Ramirez, Guillaume Marcaud, Carlos Alonso-Ramos, Xavier Le Roux, Kathleen A. Richardson, Nicolas Dubreuil, Delphine Marris-Morini, Juejun Hu, Frédéric Boeuf, Sébastien Cremer, Stéphane Monfray, Eric Cassan, and Laurent Vivien
OW1C.2 Optoelectronic Devices and Integration (OEDI) 2019