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Toward maximally dense 3D photonic integration and routing with three-plane amorphous silicon

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Abstract

We demonstrate a three-plane amorphous silicon photonic platform with < 3·10−4 dB loss per out-of-plane crossing, ~6× reduced crosstalk between planes via a phase velocity mapping strategy, and 36 µm long interplane couplers with 0.05 dB loss.

© 2017 Optical Society of America

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