Prospects for Electronic Photonic Integration

K.A. Williams

doi:10.1364/IPRSN.2017.IW3A.1

Advanced Photonics 2017 (IPR, NOMA, Sensors, Networks, SPPCom, PS)
OSA Technical Digest (online) (Optica Publishing Group, 2017),
paper IW3A.1
•https://doi.org/10.1364/IPRSN.2017.IW3A.1

Prospects for Electronic Photonic Integration

K.A. Williams

Integrated Photonics Research, Silicon and Nanophotonics 2017

New Orleans, Louisiana United States
24–27 July 2017
ISBN: 978-1-943580-30-9

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Symposium on Photonic and Electronic-Photonic Integration (IW3A)

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K. A. Williams, "Prospects for Electronic Photonic Integration," in Advanced Photonics 2017 (IPR, NOMA, Sensors, Networks, SPPCom, PS), OSA Technical Digest (online) (Optica Publishing Group, 2017), paper IW3A.1.

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Abstract

As InP integrated photonic circuits increase in complexity, component density, and circuit performance, electronic circuits need to be positioned ever-closer. We review the challenges and potential advantages for intimate electronic wafer to photonic wafer assembly.

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