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Lithographically-defined 3-D Chip-scale Optical Interconnects Enabling Ultra-small Footprint Vertical Waveguide Couplers

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Abstract

Multi-mode waveguide fabrics are fabricated using gray-scale lithography on hybrid Si/III-V modulator chips. Novel vertical couplers provide access to a high-density transceiver array providing a seam-less interconnection fabric between the intra- and inter-chip domains.

© 2012 Optical Society of America

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