Laser machining of ferrite ceramics was previously done1–3 with the purpose of fabricating magnetic devices using a focussed continuous laser beam to scan the sample placed in a gas (e.g., CC14) or liquid chemical (e.g., KOH solution). Such a spot-scanning approach has several drawbacks: (1) a “serial processing” technique, the through-put for large-area processing is slow; (2) the etching depth is hard to control since the focussed laser spot can remove many microns of materials during its pulse duration or dwell time on a spot; (3) for high-resolution patterning, the quality of the border and side-wall is hard to control because of the “scalloping” effect of the focussed laser spot; (4) the use of chemicals is at least inconvenient if not damaging to delicate components.

© 1991 Optical Society of America

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