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Effects of laser chemical vapor deposition parameters on a-Si:H film properties

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Abstract

The effects of hydrogen content on the optical, chemical, structural, and electric conductivity properties of the laser chemical vapor-deposition (L-CVD) thin films of an amorphous silicon-hydrogen alloy (a-Si:H) are investigated herein. In the L-CVD technique an excimer laser operating ArF transition provides 193-nm radiation. The laser light, having 18-W maximum average power, illuminates the substrate surface under the angle of incidence ψi, ranging from 0 to 90°. The feedstock gas disilane, Si2H6, and carrier gas, He, introduce into the preevacuated (~10−6-Torr) deposition chamber. The flow rate ratio of Si2H6/He and working pressure were 110 and 10 Torr, respectively. Disilane absorbs energy from laser light producing free radicals following photodissociation. The free radicals condensate on the substrate surface to form a-Si:H films. The deposition rate increases with increasing angle of incidence and decreases with increasing laser power. The typical deposition rate and thickness of the L-CVD a-Si:H films were 13 nm/min and 200 nm, respectively. Substrate temperature Ts ranging from 35 to 350°C was used to control hydrogen content in the films.

© 1986 Optical Society of America

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