Expand this Topic clickable element to expand a topic
Skip to content
Optica Publishing Group

CW Operation of Distributed Face Cooling Chip for Tiny Integrated Lasers

Not Accessible

Your library or personal account may give you access

Abstract

A Distributed Face Cooling chip which consist or periodic Sapphire and Nd3+:YAG crystals is introduced. The chip is made by surface activated bonding technology at room temperature. CW operation with slope efficiency of 59% is obtained with higher output power compared to Nd3+:YAG rod crystal in the same pumping conditions.

© 2017 Optical Society of America

PDF Article
More Like This
Surface Activated Bonding (SAB) based Sub-nanosecond Distributed Face Cooling (DFC) Handheld Laser

Lihe Zheng and Takunori Taira
ATu5A.5 Advanced Solid State Lasers (ASSL) 2018

LIDT Evaluation of Bonded Crystals for J-class Energy System

Arvydas Kausas and Takunori Taira
ca_p_24 The European Conference on Lasers and Electro-Optics (CLEO/Europe) 2023

High Damage-Resistant Coating Solution for High-Field Ceramics Laser

Lihe Zheng and Takunori Taira
JTh2A.3 Advanced Solid State Lasers (ASSL) 2017

Select as filters


Select Topics Cancel
© Copyright 2024 | Optica Publishing Group. All Rights Reserved