Silicon Photonic devices and circuits based on hybrid integration

Liu Liu; Liu Liu; Pengxin Chen; Ziliang Ruan; Xian Zhang

Asia Communications and Photonics Conference (ACPC) 2019
OSA Technical Digest (Optica Publishing Group, 2019),
paper S4H.1

Silicon Photonic devices and circuits based on hybrid integration

Liu Liu, Pengxin Chen, Ziliang Ruan, and Xian Zhang

Asia Communications and Photonics Conference 2019

Chengdu China
2–5 November 2019
ISBN: 978-1-943580-70-5

From the session
Heterogeneous Photonic Integration on Silicon II (S4H)

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L. Liu, P. Chen, Z. Ruan, and X. Zhang, "Silicon Photonic devices and circuits based on hybrid integration," in Asia Communications and Photonics Conference (ACPC) 2019, OSA Technical Digest (Optica Publishing Group, 2019), paper S4H.1.

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Abstract

Hybrid integration technology, including die-to-wafer bonding and flip-chip bonding, is introduced for realizing high-performance modulators and lasers on a silicon photonic integrated circuit.

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