Heatsink topology based optical interconnect for datacenters

Bing Yang; Yu Gong; Xuezhi Hong; Jiajia Chen; Jiajia Chen

doi:10.1364/ACPC.2017.M1C.4

Asia Communications and Photonics Conference
OSA Technical Digest (online) (Optica Publishing Group, 2017),
paper M1C.4
•https://doi.org/10.1364/ACPC.2017.M1C.4

Heatsink topology based optical interconnect for datacenters

Bing Yang, Yu Gong, Xuezhi Hong, and Jiajia Chen

Asia Communications and Photonics Conference 2017

Guangzhou, Guangdong China
10–13 November 2017
ISBN: 978-1-943580-34-7

From the session
Data Center Networks (M1C)

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B. Yang, Y. Gong, X. Hong, and J. Chen, "Heatsink topology based optical interconnect for datacenters," in Asia Communications and Photonics Conference, OSA Technical Digest (online) (Optica Publishing Group, 2017), paper M1C.4.

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Abstract

We propose an optical interconnect architecture based on heatsink topology to enhance reliability for large-scale datacenters. The experimental demonstration has been carried out to verify the transmission performance of the proposed architecture.

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